Publikationen

Kontaktlose-Energie-Datenuebertragung-in-Systemen-schnell-bewegte-Komponenten-Demonstrator-Leistungszentrum-ElektronikSysteme-LZE

Publikationen

Kontaktlose Energie- und Datenübertragung in Systemen mit schnell bewegten Komponenten

Heckel. Pulse capacitors for turn off overvoltage reduction – blessing or curse?
Erlangen. März 2015

Eckardt, Heckel. High Power Density Automotive Converters using SiC or GaN Power Devices.
Automotive Power Electronics/ Paris/ 14. April 2015

Heckel. Technologiedemonstrator zur kontaktlosen Energie- und Datenübertragung.
PCIM Messe/ Nürnberg/ 10. May 2015

Sanftl. Reliabe Data Link for Power Transfer Control in an Inductive Charging System for Electric Vehicles.
IET Letter/ San Diego/ 18. May 2015

Heckel, Eckardt, März, Frey. SiC MOSFETs in Hard-Switching Bidirectional DC/DC Converters.
Materials Science Forum, Bd. 821, 2015

Frey. LZE und Technologiedemonstrator zur kontaktlosen Energie- und Datenübertragung.
Tag der Elektrotechnik/ Erlangen/ 17. July 2015

Hofmann, Eckardt, Heckel. Inverter technology for high-speed drives like electric turbochargers.
IKMT/ pp. 1 – 6/ ISBN: 978-3-8007-4072-7/ Köln/14. September 2015

Lorentz, Schwarz, Heckel, März, Frey. Integrated Galvanically Isolated MOSFET and IGBT Gate-Driver Circuit with Switching Speed Control.
Proceedings of 41st Annual Conference of the IEEE Industrial Electronics Society (IECON), 2015

Eckardt. Technologiedemonstrator zur kontaktlosen Energie- und Datenübertragung.
IAA/ Frankfurt/ 09. September 2015

Trautmann. Implementation of Simultaneous Energy and Data Transfer for Charging Electric Vehicles.
Nürnberg. September 2015

Kreutzer. Using SiC MOSFET’s full potential – Switching faster than 200 kV/µs.
ICSCRM/http://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=7369313. Naxos/04. October 2015

Heckel. Bearing with Integrated Energy and Data Transmission.
SEMICON/ Dresden/ 06. October 2015

Heckel. A Novel Charge Based SPICE Model for Nonlinear Device Capacitances.
SISPAD/Washington/09. October 2015

Heckel. Fundamental Efficiency Limits in Power Electronic Systems.
Osaka, Japan. October 2015

Heckel. Schaltungssimulation mit schnellen Leistungshalbleitern.
Cluster Leistungselektronik. Nürnberg. Oktober 2015

Heckel, Frey. A Novel Charge Based SPICE Model for Nonlinear Device Capacitances.
WiPDA/Blacksburg/03. November 2015

Eckardt. Technologiedemonstrator zur kontaktlosen Energie- und Datenübertragung.
Open Inspiration Day/ Herzogenaurach/ 04. November 2015

Eckardt. Design and Optimization of a Multi-Coil System for Inductive Charging with Small Air Gap.
Herzogenaurach. November 2015

Kreutzer. Optimum gate driver design to reach SiC-MOSFET’s full potential – speeding up to 200 kV/µs.
WiPDA/ Institute of Electrical and Electronics Engineers -IEEE-:IEEE 3rd Workshop on Wide Bandgap Power Devices and Applications. pp.92-97/ ISBN: 978-1-4673-7885-7/ Blacksburg, Virginia, USA/02.-04. November 2015.

Sanftl. Communication System for Joint Wireless Energy and Data Transmission for Inductivly Coupled Systems.
RWW/Austin/24. Januar 2016

Kreutzer, Heckel, März. Using SiC MOSFET’s Full Potential – Switching Faster than 200 kV/μs.
Materials Science Forum, Bd. 858, 2016

Trautmann, Joffe, Pflaum, Sanftl, Weigel, Heckel, Kölpin. Implementation of Simultaneous Energy and Data Transfer in a Contactless Connector.
RWW/ IEEE Topical Conference on Wireless Sensors and Sensor Networks (WiSNet). pp. 1-3./ Austin/24. Januar 2016

Krach, Thielen, Heckel, Bauer, Erlbacher, Frey. Silicon Integrated RC Snubbers for Applications up to 900 V with Reduced Mechanical Stress and High Manufacturability.
Proceedings of 74th Annual Device Research Conference (DRC), 2016

Ziller, Dräger, Heckel. Inductive high data rate transmission for bearings systems.
RWW/Austin/24. Januar 2016

Ziller, Dräger, Heckel. Inductive high data rate transmission for bearings systems.
IEEE Topical Conference on Wireless Sensors and Sensor Networks WiSNet 2016

Endruschat, Heckel, Reiner, Waltereit, Quay, Ambacher, März, Eckardt, Frey. Slew Rate Control of a 600 V 55 mOhm GaN Cascode.
Proceedings of IEEE 4thWorkshop on Wide Bandgap Power Devices and Applications (WiPDA), 2016

Krach, Heckel, Frey, Bauer, Erlbacher, März. Innovative monolithic RC-snubber for fast switching power modules.
CIPS/Nürnberg/08. März 2016

Joffe. Design and Optimization of a Multi-Coil System for Inductive Charging with Small Air Gap.
APEC/ Long Beach/ 20. March 2016

Ditze, Heckel, März. Influence of the Junction Capacitance of the Secondary Rectifier Diodes on Output Characteristics in Multi-Resonant Converters.
APEC/ Long Beach/ 20. March 2016

Schriefer. Mechanical Reliablity of Power Electronic Systems.
CIPS. Nürnberg. März 2016

Ditze, Endruschat, Schriefer, Rosskopf, Heckel. Inductive Power Transfer System with a Rotary Transformer for Contactless Energy Transfer on Rotating Applications.
ISCAS/Montreal/22. Mai 2016

Sanftl. A Novel Approach for Reliable Communications within Inductive Power Transfer Systems.
Aveiro, Portugal. Mai 2016

Heckel. Fundamental Efficiency Limits in Power Electronic Systems.
INTELEC/Osaka/20. October 2016

Rosskopf. Optimierte Auslegung induktiver Energie-Übertragungskomponenten.
Leistungselektronik-Kolloquium. Erlangen. Oktober 2016

Dräger. Nahfelddatenübertragung in Koexistenz mit Energieübertragunssystemen.
Leistungselktronik-Kolloquium. Erlangen. Oktober 2016

Sanftl. A Robust Light-Weight Protocol Stack for Data Transmission within Inductive Power Transfer Systems.
Denpasar, Indonesien. November 2016

Heckel. Messung schneller Schaltvorgänge mit Wide.
Cluster Leistungselektronik. Reutlingen. November 2016

Ehrlich. Design and Optimization of an highly integrated inductive power transfer system for pluggable applications.
Electronica. München. November 2016

Sanftl. A Direct RF-to-Baseband Quadrature Subsampling Receiver Using a Low Const ADC.
Phoenix, USA. Januar 2017

Hürner, Heckel, Endruschat, Erlbacher, Bauer, Frey. Analytical Model for the Influence of the Gate-Voltage on the Forward Conduction Properties of the Body-Diode in SiC-MOSFETs.
International Conference on Silicon Carbide and Related Materials (ICSCRM), 2017

Gerstner, Heckel, Endruschat, Rosskopf, Eckardt, März. Loss Reduction of SiC Power Modules by Impedance-Optimized Gate Drive Voltages and PWM Gate Drive Patterns.
IEEE 5thWorkshop on Wide Bandgap Power Devices and Applications (WiPDA), 2017

Endruschat, Heckel, Gerstner, Joffe, Eckardt, März. Application-Related Characterization and Theoretical Potential of Wide-Bandgap Devices.
IEEE 5thWorkshop on Wide Bandgap Power Devices and Applications (WiPDA), 2017

Heckel, Zeltner, Eckardt, März. Fast Switching with GaN and Dynamic On-Resistance from Application View-Point.
GaN Power Electronics Roadmap, Journal of Physics D: Applied Physics (JPhysD), 2017

Heckel. SiC and GaN in Automotive Power Electronics.
SEMICON Taiwan. Taipei, Taiwan. September 2017

 

 

 

 

 

 

 

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